Enterprise applications
ERP · MOM · MES · APS · BI · AI
← BackVSKYSOFT · EAPConnect every machine.
Connect every machine.
Turn data into automation.
The Equipment Automation Platform unifies machine connectivity, real-time acquisition, equipment control, process parameters and recipe management—delivering standardized production data to MES, MOM, APS, QMS, WMS, BI and AI.
LIVE EQUIPMENT DATA CONNECTED
01 · PLATFORM ARCHITECTURE
A unified automation data layer between enterprise systems and the industrial floor.
EAP abstracts equipment brands, protocols and data structures, continuously supplying upper-layer applications with trusted, real-time and actionable data.
EAP platform
Connectivity · Data acquisition · Control · Recipe · Data model
Industrial floor
PLC · SMT · Semiconductor · Photovoltaic · Robot · Vision
02 · OPEN CONNECTIVITY
Connect mainstream PLCs, automation equipment and industrial networks.
PLCs & CONTROLLERS
Siemens S7Beckhoff TwinCATMitsubishiOmronRockwell Allen-BradleySchneider ElectricDeltaKeyencePanasonicFatek
INDUSTRIAL PROTOCOLS
OPC UAOPC DAModbus TCPModbus RTUMQTTTCP/IP SocketREST APIWebSocketEtherNet/IPProfinetEtherCATCC-Link IECAN Bus
03 · SMT EQUIPMENT INTEGRATION
Connect equipment and quality data across the complete SMT line.
From printing, SPI and placement through reflow, AOI and X-ray, normalize multi-vendor machine data into one production context.
Pick & Place
ASM (SIPLACE), FUJI, Yamaha, Mycronic, JUKI, Panasonic, Hanwha and Universal InstrumentsProgram, state, UPH, cycle time, throw rate, nozzle, feeder, PCB, alarms, downtime reasons and OEE
Solder Paste Printer
DEK, EKRA, MPM, Panasonic, GKG and YamahaPrint parameters, PCB, program, cycle time, alarms, paste life and cleaning count
SPI Inspection
Inline SPI equipmentThickness, area, offset, volume, NG type, trends and SPC
AOI Inspection
Koh Young, Omron, Mirtec, CyberOptics, Parmi and ViTroxDefect type, NG image, location, PCB barcode, repair result and yield
X-Ray Inspection
Nordson DAGE, Unicomp, SEC and ViscomTest result, void %, solder-joint analysis, inspection image and NG data
Reflow Oven
Heller, Rehm, BTU, Vitronics Soltec and ERSATemperature profile, conveyor speed, zone temperature, oxygen, alarms and recipe
04 · CORE CAPABILITIES01 02 03 04
A governed automation loop—from data acquisition to machine execution.
Millisecond real-time acquisition
Combine event-driven and periodic collection for equipment state, process parameters, recipes, alarms, logs, product data, cycle, OEE, energy and environment.
Recipe lifecycle management
Download, upload, verify, lock, approve, compare and version recipes, with automatic product-change dispatch.
Remote equipment control
Under governed permissions, execute Start, Stop, Reset, Pause, Resume, Program Download, Recipe Switch and Remote Command.
Unified equipment data model
Standardize Equipment, Line, Station, Product, Program, Recipe, Alarm, Event, Parameter and OEE objects.
05 · RECIPE · CONTROL · AI
Put equipment data to work in decisions, control and continuous improvement.
Build on governed recipes and remote operations with equipment health, anomaly detection, process correlation and fault prediction—helping engineering teams understand issues and act sooner.
Anomaly detectionDetect state and parameter deviationOEE analysisLocate availability and performance lossEquipment healthQuantify health trends and riskProcess optimizationRelate parameters to outcomesFault predictionIdentify downtime risk earlierRoot-cause analysisConnect alarms, process and quality
INDUSTRIAL AI QUESTIONS
Why did UPH fall today? · Which line is constraining output? · Why did AOI NG suddenly increase?
06 · PLATFORM VALUE01 02 03 04 05
Lower integration cost, transparent equipment operations and a stronger data foundation for intelligent manufacturing.
Open connectivity
Unify multi-vendor, multi-protocol equipment
Fast implementation
Reuse drivers, models and industry templates
High reliability
7×24 operation, reconnect, recovery and monitoring
Unified data
Standard data for MOM, BI, AI and digital twins
Industry practice
SMT, semiconductor, PV, new energy, automotive electronics and PCB
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